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Jun 6, 2011 / Labels: ,

PhD Summerschool at DTU Mekanik - "Micro Mechanical System Design and Manufacture"

A new edition of the DTU Mekanik summer school on micromechanical systems design will start soon at DTU site in Copenhagen, from 20 June 2011 to 01 July 2011. 

This course is situated in the context of emerging micro/nano technologies. Micromechanical components play an increasing role in micro systems. The use of metals, polymers and ceramics for miniature components requires product development methods as well as manufacturing technologies. Product dimension will range from micrometre to millimetre. The attendees will get insights on the complete product development from requirements and technology possibilities to manufacturing and testing, in an industrial perspective. Indeed it is now well known that micro/nanotechnology is not only a matter of downscaling applications and methods.


For more information and registration, see the course website.

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Apr 14, 2011 / Labels:

COMSOL Conference 2011

The seventh edition of the COMSOL Conference will be held in Boston, MA, 13-15 October. The program is packed with user presentations, hands-on minicourses and networking opportunities. Users of COMSOL Multiphysics® are invited to submit abstracts describing projects in which they have made achievements using simulation software.

The suggested topics area include:
  • Acoustics and Vibrations
  • Batteries and Fuel Cells
  • Bioscience and Bioengineering
  • Chemical Reaction Engineering
  • Computational Fluid Dynamics
  • Education
  • Electrochemistry
  • Geophysics
  • Heat Transfer & Phase Change
  • Electromagnetics
  • MEMS & Piezoelectric Devices
  • Microfluidics
  • Multiphysics
  • Nanotechnology
  • Numerical Methods
  • Optimization
  • Optics, Photonics & Plasmonics
  • Plasma Physics, EHD & MHD
  • Porous Media Flow
  • Quantum Mechanics
  • RF & Microwaves
  • Semiconductor Devices
  • Sensors and Actuators
  • Structural Mechanics
  • Transport Phenomena
Abstracts submitted by the early bird deadline of June 17th will receive a reduced registration rate of $195. The final deadline for the submission of abstracts is August 1st. Interested parties should visit http://www.comsol.com/conference2011/usa/papers for complete details including important dates and guidelines for submitting and uploading abstracts.
For more information on the COMSOL Conference 2011 Boston, visit http://www.comsol.com/conference2011/usa.

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Oct 22, 2010 / Labels:

Imec sets up R&D activity in Taiwan

Imec Taiwan signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec Taiwan Innovation Centre (ITIC). ITIC’s goal is to expedite applied research projects with industry and academia that will result in electronic designs, components and technology solutions. The new R&D centre will focus on a variety of innovative applications in bioelectronics, MEMS and “green” electronics that are enabled through 3D system-package co-design and system-level evaluation.

The worldwide impact of the Taiwanese semiconductor and consumer electronics industry is unequivocal, and there is an increasing intention of the stakeholders to move up the value chain by entering key innovation areas. Consequently, Taiwan is an important market for a nanoelectronics R&D centre such as imec. ITIC, being imec’s local R&D centre in Taiwan, will facilitate and intensify the collaboration between imec and the Taiwanese industry and academia. The business plan for ITIC forecasts a growth of its research staff to 40+ over 3 years. ITIC is launched with the signing today of an agreement between imec Taiwan and the Institute for Information Industry (III) on behalf of the Taiwanese MOEA. ITIC is financed by imec Taiwan and will be co-funded by the Taiwanese MOEA as a “Multinational Innovative R&D Centre” under MOEA subsidy for the Project of Encouraging Foreign Enterprise Establishing Research and Development Center in Taiwan.

“The creation of ITIC, two years after having established a representation office in Hsinchu, Taiwan, is essential in our continued efforts to create value for our current and future partners in Taiwan, to leverage our global partnerships, and to actively interact with the Taiwanese ecosystem. An R&D initiative such as ITIC will intensify imec’s interaction with the local semiconductor and system-level companies and academia.” - Luc Van den hove, CEO and President of imec and member of the Board of imec Taiwan.
“As a semiconductor innovative applications centre, ITIC will support the upward shift in Taiwan’s technology value chain and contribute to the realization of Taiwan’s strategic Innovation Plan. It will accelerate open innovation that will result in locally owned IP in the area of intelligent electronics. The presence of ITIC - the local branch of the world-famous R&D centre imec - will improve Taiwan’s position against its peers in Asia, and result in attracting more European companies to invest in Taiwan.“ - Jung-Chiou Hwang, Vice Minister of Economic Affairs.

Further information on imec can be found at www.imec.be.

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Oct 7, 2010 / Labels: ,

Coventor and Process Relations Collaborate to Streamline Fabrication Process Development

Coventor, Inc., the leading supplier of software for developing micro-electromechanical systems (MEMS), and Process Relations, a provider of enterprise data information management systems for high tech process development, announced today a collaboration to develop and market integrated solutions to improve the efficiency of developing next generation fabrication processes for semiconductor and MEMS manufacturers.

As part of the cooperation, the companies have developed an interface between the Process Development Execution System XperiDesk datainformation management system from Process Relations and Coventor’s 3D emulation software SEMulator3D. The integration builds on the work the two companies have done within the European FP7-funded CORONA project, a multi-company initiative to improve the efficiency of the value chain in micro- and nanotechnologies.
"Semiconductor based fabrication processes are becoming increasingly complex. The unique process emulation capabilities of SEMulator3D enable fast, accurate 3D modeling of semiconductor and MEMS process. Virtual fabrication with SEMulator3D can solve manufacturing problems early, improving time-to-market and reducing costs. The integration of SEMulator3D with Process Relations XperiDesk creates a powerful solution for engineering collaboration.” - Ken Greiner, Product Manager for SEMulator3D

“Having a single interface to perform process design, verification, simulation and experimentation provides process and device design engineers with a common collaboration platform. Layered models allow developers to seamlessly convert process engineer nomenclature into device engineer nomenclature. The advanced emulation capabilities of Semulator3D combined with the abstractions in XperiDesk allow all engineers to use virtual manufacturing techniques without intimate knowledge of the emulation tools.” - Dirk Ortloff, CTO and Co-founder of Process Relations



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Aug 17, 2010 / Labels:

TCT Live 2010 Additive Manufacturing Conference Programme Announced

The organiser of TCT Live — the leading event for Software and Technology for Product Development and Manufacturing — is delighted to announce that the 2010 Additive Manufacturing Conference Programme has now been finalised. Taking place at the Ricoh Arena, Coventry, 19th-20th October, the conference has once again attracted the industry’s most prominent and influential experts to present.

The Additive Manufacturing Conference constantly evolves to keep pace with this fast-moving industry and as such this year the sessions have been focused on specific industry sectors looking at how the boundaries of additive manufacture are being pushed ever further.

The sessions include: The ALM Landscape — looking at the industry as a whole and how companies are embracing the potential offered; Breakthroughs in ALM Technology, which will address the key groundbreaking developments in the last 12 months; Jewellery Session — an overview of how the jewellery industry is benefiting from the advantages of additive manufacturing; Medical/Dental — a selection of cutting-edge case studies reflecting true applications of the technology; and finally Transport — as one of the first industries to embrace additive manufacture the transport session will take a close look at a wide range of applications in automotive and aerospace.

TCT Live is particularly pleased to welcome from the United States Todd Grimm, from T.A. Grimm Associates, who will present the Keynote address on Day one of the show. Todd is one of industry’s most influential figures with a background of over 17 years in rapid prototyping and additive manufacturing technologies.

Day two of the conference will kick off with an exciting keynote presentation from Mark Chapman, Chief Engineer of the Bloodhound Project, the team behind the fastest-ever land-speed challenge car. His presentation will give an overview of the project so far, identifying the challenges faced and the part that additive manufacturing is playing in helping to resolve these issues.

An impressive array of speakers have been lined up to follow over the course of the two days including presentation from Rolls Royce, EADS, Astrium Space Transportation, Honda R&D, DUT Racing, Cranfield University, Future Factories, Econolyst, Marianne Forrest Ltd and more.

The organiser, Rapid News Publications, is fully confident of attracting a record number of industry experts to this years’ show who are looking to network with like-minded professionals, develop their knowledge and keep their company one step ahead of the competition. Attendance to the TCT Live exhibition and conference is completely free of charge.

For the full conference programme and to pre-register, please visit www.tctshow.com.

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Mar 6, 2010 / Labels:

Elsevier and NanoInk webinar

Elsevier and NanoInk organize the "Nanoscale Biomaterials Deposition: Learning to speak the language of biology" webinar, on 16 March 2010, 1700 GMT, 12 EST (duration: 1 hour).

The webinar will cover the following topics:
Phospholipids as a biocompatible ink for dip-pen nanolithography (Steven Lenhart)
Being a major structural and functional component of biological membranes, phospholipids are compatible with the vast array of molecular resources provided by nature.  Incorporation of biofunctional lipids into the ink allows the subcellular patterning of multiple proteins under the area of a single cell.  Furthermore, the capability of fabricating arbitrary nanopatterns with innately biofunctional lipids opens new possibilities in the fabrication of nanostructured biosensor elements.
Parallel Deposition and Orthogonal Tagging of Functionalized Hydrogels using DPN (Paul Stiles)
A method for the parallel deposition of functionalized nanoscale hydrogels is discussed.  The method is completely general and can be used to simultaneously pattern multiple arrays of proteins, peptides, nanoparticles or any combination of the three.  Utilizing existing proteomics chemistry, we see how we can orthogonally react multiple molecules/nanoparticles to their predetermined nanoscale hydrogel array in a single step.                     
Micro and Nanoscale Approaches for Interfacing with the Nervous System (Justin Williams)
In this presentation a variety of approaches is reviewed for controlling the adhesion, growth and interconnectivity of neurons in culture.  A number of new and very promising approaches for studying neuronal cells, which integrate microfluidic systems with microelectronics and micro/nano protein patterning is also discussed.  Finally, the development of various microfluidic and micropatterning approaches for controlling the local microenvironment of neural cells in micro-culture devices is described.

This webinar will be of value to material and life scientists, biologists, physicists and all researchers with an interest in nanotechnology.

More information and registration.

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World MEMS Players report from Yole

Yole Développement recently released its annual ranking of Top 30 MEMS Companies based on Yole’s market research and industry expertise. Key facts from the 2009 ranking highlighted by Jean-Christophe Eloy, CEO of Yole Développement include: Overall combined sales of the 2009 Top 30 MEMS Companies saw a first ever drop with a 5% decrease; Open MEMS Foundries get confirmation of a winning business model; Texas Instruments climbs back into the top position; Expanding new markets InvenSense is the Top 30 leader in growth with 500% increase in sales.

“After 2 years at number 2 in the ranking, Texas Instruments (TI) comes back as the leader of the TOP 30 MEMS Companies with sales reaching $648 Million in 2009” according to JC Eloy. Despite a decrease in sales in its DLP product portfolio, TI surpassed Hewlett Packard (HP) that now sits in second place. HP was hit by the slowdown in printer demand and a decrease of print head average selling price over the 2 past years. HP had a 14% decrease for MEMS device sales value in 2009.

Robert Bosch is back to 3rd in the ranking. Robert Bosch’s MEMS revenues take into account Bosch MEMS automotive revenues, and Bosch Sensortec sales. Yole Développement’s estimations highlight a 125% growth for Bosch Sensortec and overall Bosch sales of $426 million in 2009.

“The combined sales of the 2009 TOP 30 MEMS Companies reached just over $5B, which is a 5% decrease compared to the TOP 30 in 2008. This is the first time the combined sales figure of the Top 30 Companies has decreased. The first half of 2009 was one of the worst for the MEMS industry especially for companies addressing consumer and automotive markets. TPMS and airbag sensor manufacturers were impacted by both price pressure and lower demand from automotive companies reducing their stocks. Denso experienced a 30% decrease in 2009 and Infineon was down 33% from 2008.” - Jean-Christophe Eloy, CEO of Yole Développement

Infineon also decreased because of the separation of Norwegian company Sensonor and the BAW business unit sale to Avago.

Who benefited in 2009, key changes in the 2009 TOP 30 MEMS ranking, the outlook for 2010 and many more information can be found in recently released Yole's report.

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